Reballing Application with the MINIOVEN 05

Reballing with the Minioven cuts cost and lead time by not outsourcing the product. Reprocessing of desoldered components can be done with the same or a different alloy, as desired.

The unit offers programmable modes and nitrogen process gas supply. Processes can be completed in as little as 3 minutes.

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The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.

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Chip Underfill on a Puma pick-and-place machine with integrated dispensing
Essemtec AG, Aesch/LU, Switzerland

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With the combination of SMART DESOLDER 01 and HOTBEAM, residual solder can be removed simply and contactless.

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