The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.
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Reballing with the Minioven cuts cost and lead time by not outsourcing the product.
Chip Underfill on a Puma pick-and-place machine with integrated dispensing
Essemtec AG, Aesch/LU, Switzerland
With the combination of SMART DESOLDER 01 and HOTBEAM, residual solder can be removed simply and contactless.
