Chip Underfill on a Puma pick-and-place machine with integrated dispensingEssemtec AG, Aesch/LU, Switzerland
Reballing with the Minioven cuts cost and lead time by not outsourcing the product.
The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.
With the combination of SMART DESOLDER 01 and HOTBEAM, residual solder can be removed simply and contactless.
