The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The temperature-controlled airflow prevents the neighboring components from warming up. After melting, the residual solder is removed contactless by the vacuum pen. The use of a Teflon tip in the vacuum pen offers outstanding features: the nonstick effect, the temperature-resistance and the mechanically soft surface of the material. The combination with HOTBEAM 04/05 significantly improves the process. Removal of residual solder can be solved precisely and safely with the two devices.
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